本文主要研究内容
作者姜楠,张亮,刘志权,熊明月,龙伟民（2019）在《FCBGA器件SnAgCu焊点的热冲击可靠性分析》一文中研究指出：采用有限元法和Garofalo-Arrheninus稳态本构方程,在热冲击条件下对倒装芯片球栅阵列封装(FCBGA)器件SnAgCu焊点的可靠性进行分析.结果表明,Sn3.9Ag0.6Cu焊点的可靠性相对较高.通过分析SnAgCu焊点的力学本构行为,发现焊点应力的最大值出现在焊点与芯片接触的阵列拐角处.随着时间的推移,SnAgCu焊点的应力呈周期性变化. Sn3.9Ag0.6Cu的焊点应力和蠕变最小,Sn3.8Ag0.7Cu焊点应力和蠕变次之,Sn3.0Ag0.5Cu焊点应力和蠕变最大,与实际的FCBGA器件试验结果一致.基于蠕变应变疲劳寿命预测方程预测三种SnAgCu焊点的疲劳寿命,发现Sn3.9Ag0.6Cu焊点的疲劳寿命比Sn3.0Ag0.5Cu和Sn3.8Ag0.7Cu焊点的疲劳寿命高.
Abstract
cai yong you xian yuan fa he Garofalo-Arrheninuswen tai ben gou fang cheng ,zai re chong ji tiao jian xia dui dao zhuang xin pian qiu shan zhen lie feng zhuang (FCBGA)qi jian SnAgCuhan dian de ke kao xing jin hang fen xi .jie guo biao ming ,Sn3.9Ag0.6Cuhan dian de ke kao xing xiang dui jiao gao .tong guo fen xi SnAgCuhan dian de li xue ben gou hang wei ,fa xian han dian ying li de zui da zhi chu xian zai han dian yu xin pian jie chu de zhen lie guai jiao chu .sui zhao shi jian de tui yi ,SnAgCuhan dian de ying li cheng zhou ji xing bian hua . Sn3.9Ag0.6Cude han dian ying li he ru bian zui xiao ,Sn3.8Ag0.7Cuhan dian ying li he ru bian ci zhi ,Sn3.0Ag0.5Cuhan dian ying li he ru bian zui da ,yu shi ji de FCBGAqi jian shi yan jie guo yi zhi .ji yu ru bian ying bian pi lao shou ming yu ce fang cheng yu ce san chong SnAgCuhan dian de pi lao shou ming ,fa xian Sn3.9Ag0.6Cuhan dian de pi lao shou ming bi Sn3.0Ag0.5Cuhe Sn3.8Ag0.7Cuhan dian de pi lao shou ming gao .
论文参考文献
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论文详细介绍
论文作者分别是来自焊接学报的姜楠,张亮,刘志权,熊明月,龙伟民，发表于刊物焊接学报2019年09期论文，是一篇关于有限元法论文,热冲击论文,焊点论文,可靠性论文,疲劳寿命论文,焊接学报2019年09期论文的文章。本文可供学术参考使用，各位学者可以免费参考阅读下载，文章观点不代表本站观点，资料来自焊接学报2019年09期论文网站，若本站收录的文献无意侵犯了您的著作版权，请联系我们删除。
标签：有限元法论文; 热冲击论文; 焊点论文; 可靠性论文; 疲劳寿命论文; 焊接学报2019年09期论文;
姜楠：FCBGA器件SnAgCu焊点的热冲击可靠性分析论文
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